LOTES to Exhibit at 2026 OCP APAC Summit, Showcasing High-Speed Connector and Cable Solutions

LOTES today announced its participation in the 2026 OCP APAC Summit, taking place August 11–12 at the Taipei Nangang Exhibition Center, Hall 2, where the company will showcase its connector and cable product lines built for AI data center and high-performance computing infrastructure.

Industry partners are welcome to visit LOTES at Booth PR04 to discuss next-generation interconnect solutions for data centers.
 

Event Details

• Date: August 11–12, 2026 (Tue–Wed)
• Venue: TaiNEX 2
• Booth: PR04