P/N : ACAM0006, ACAM0008
CAMM2 (Compression Attached Memory Module - Gen2) connector is compress-mount technology (CMT) connector design to cater for low space height requirements, which is defined in JEDEC for applications where a CAMM2 module card mounted over the connector, parallel to the system board.
CAMM2 connector provides faster transmission speed and supports higher bandwidth RAM. The lower height also has better airflow and help on heat dissipation.
CAMM2 connector includes 1.00mm, 1.85mm, and 2.85mm height with dual channel which support LPDDR5 / DDR5 application. In addition, it also includes 2.85mm and 7.50mm height with single channel which support stacked DDR5 application. Besides, CAMM2 is also fully scalable and can support various applications.
Application
・Notebook
・Desktop
・Server
Feature
・Dual channel
・Double-sided compress mount
・Screw mount
・1.00H CAMM2 supports 32GB / 64GB LPDDR5
・2.85H CAMM2 supports 16GB / 32GB / 64GB DDR5
● CAMM2 Connector Family
Height | P/N | Pin Count | Type | Application | Status |
1.00 | ACAM0006 | 644 Pins | Dual Channel | 32GB / 64GB LPDDR5 | Tooled |
ACAM0013 | Cover | ||||
ACAM0015 | Back Plate | ||||
2.85 | ACAM0008 | 356 Pins + Ground Shielding | Dual Channel | 16GB / 32GB / 64GB DDR5 | Tooled |
2.85 | TBD | 178 Pins + Ground Shielding | Single Channel | DDR5 (Stacked) | Developing |
7.50 | TBD | 178 Pins + Ground Shielding | Single Channel | DDR5 (Stacked) | Developing |
1.85 | TBD | 356 Pins + Ground Shielding | Dual Channel | DDR5 | TBD |
Product General Characteristic |
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Physical Characteristic | |
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Housing Material | LCP_Black, UL 94V-0 |
Contact Material | Copper Alloy |
Plating Material on Contact Area | Gold |
Plating Thickness on Contact Area | Au 1u”/ 10u”/ 15u” |
Pitch | X 1.38mm, Y 1.00mm |
Durability | 25 Cycles |
Electrical Characteristic | |
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Current Rating | 1.0A |
Max. Voltage | 500V DC |
Solder Process Characteristic |
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Environment Characteristic | |
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RoHS / Halogen Free (HF) Compliance | HF |
Others | |
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Packaging | Tray |