P/N : AZIFA191
Product General Characteristic | |
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Component Type | Receptacle |
PCB Mount Type | SMT |
Orientation | Vertical |
Physical Characteristic | |
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Housing Material | LCP |
Contact Material | Copper Alloy |
Plating Material on Contact Area | Au |
Plating Thickness on Contact Area | 30u" |
Circuits | 5964 pin |
Pitch | 0.87mm x 1.0mm |
Durability | 30 Cycles |
Housing Color | Black |
Electrical Characteristic | |
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Current Rating | 1.25A |
Max. Voltage | 100V AC |
Solder Process Characteristic | |
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Solder Process Type | IR Reflow |
Max. Process Temperature | 260℃ |
Duration at Max. Process Temperature | 10s |
Environment Characteristic | |
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RoHS / Halogen Free(HF) Compliance | HF |
Others | |
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Packaging | Tray |