P/N : APOWA112-P001C10C
Product General Characteristic | |
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PCB Mount Type | DIP |
Physical Characteristic | |
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Housing Material | High Temperature Plastic |
Contact Material | Copper Alloy |
Plating Material on Contact Area | Gold |
Pitch | 2.54mm |
Durability | 200 Cycles |
Electrical Characteristic | |
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Rated Current | Power Contact: 44A/Set Pin; Signal Contact: 0.5A/Pin |
Rated Voltage | 250V |
Solder Process Characteristic | |
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Solder Process Type | Wave Soldering |
Max. Process Temperature | 260°C |
Duration at Max. Process Temperature | 5s |
Environment Characteristic | |
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RoHS / Halogen Free (HF) Compliance | HF |
Operation Temperature | -55°C to 105°C |
Others | |
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Packaging | Tray |