P/N : ABTBA028-P001C00CC(25mm);ABTBA029-P001C00CC(150mm)
Presslink is engineered for ultra-thin, space-constrained applications, supporting PCIe 5.0 data rates. This 197-pin single-compression interposer offers scalable options, providing a stable and flexible solution for board-to-board and board-to-module connections.
The Presslink connector is assembled with solder pads on the FPC using Surface-Mount Technology (SMT). This design facilitates efficient signal transmission between separate circuit boards via the FPC's internal traces.
Application
・ Notebook
・ Desktop
・ Consumer Devices
・ Server
Feature
・ Space saving
・ PCIe 5.0 supported
・ Multilayer routing for compact, high-density signal integration
・ Signal and power delivery

| Product General Characteristic |
|---|
| Physical Characteristic | |
|---|---|
| Housing Material | High Temperature PI; LCP |
| Contact Material | Copper Alloy |
| Plating Material on Contact Area | Gold |
| Pitch | 1.0 x 1.0mm |
| Durability | 25 Cycles |
| Electrical Characteristic | |
|---|---|
| Current Rating | 0.5 ~ 1.0A+ per pin |
| Max. Voltage | 100V AC |
| Solder Process Characteristic |
|---|
| Environment Characteristic | |
|---|---|
| RoHS/ Halogen Free(HF) Compliance | HF |
| Others | |
|---|---|
| Packaging | Tray |