P/N : AGNZA193-P001C00CC

| Product General Characteristic |
|---|
| Physical Characteristic | |
|---|---|
| Housing Material | LCP_Black |
| Contact Material | Copper Alloy |
| Plating Material on Contact Area | Gold |
| Plating Thickness on Contact Area | Au 30u" |
| Circuits | 168pin |
| Pitch | 0.60mm |
| Durability | 200Cycles |
| Electrical Characteristic | |
|---|---|
| Current Rating | 1.1A Max |
| Max. Voltage | 29V AC |
| Solder Process Characteristic | |
|---|---|
| Solder Process Type | IR Reflow |
| Max. Process Temperature | 260℃ |
| Duration at Max. Process Temperature | 10s |
| Environment Characteristic | |
|---|---|
| RoHS/ Halogen Free(HF) Compliance | HF |
| Others | |
|---|---|
| Packaging | Tray |