P/N : AGNZ0023-P003AC
Product General Characteristic | |
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Product Overview | Gen-Z Vertical 4C Conn. PCIe 5.0 |
Component Type | Receptacle |
PCB Mount Type | SMT |
Orientation | Vertical |
Physical Characteristic | |
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Housing Material | LCP |
Contact Material | C7035 |
Plating Material on Contact Area | Au |
Plating Thickness on Contact Area | 30u" |
Circuits | 140 pin |
Pitch | 0.60mm |
Tail Length | 1.83mm |
Locating Post | 1.40mm |
Durability | 200 Cycles |
Housing Color | Black |
Electrical Characteristic | |
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Current Rating | 1.1A |
Max. Voltage | 300V AC |
Solder Process Characteristic | |
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Solder Process Type | IR Reflow |
Max. Process Temperature | 260℃ |
Duration at Max. Process Temperature | 10s |
Environment Characteristic | |
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RoHS/ Halogen Free(HF) Compliance | HF |
Others | |
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Packaging | Reel |