P/N : ABA-WAF-527
Product General Characteristic | |
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Product Overview | 3.0mm Pitch 2x4 Pin Vertical DIP Wafer |
Component Type | Receptacle |
PCB Mount Type | TH |
Orientation | Vertical |
Physical Characteristic | |
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Housing Material | LCP |
Contact Material | C1100 |
Plating Material on Contact Area | Tin |
Plating Thickness on Contact Area | 80u" |
Circuits | 8 Pin |
Pitch | 3.0mm |
Tail Length | 4.9mm |
Locating Post | 1.0mm |
Durability | 25 Cycles |
Housing Color | Black |
Electrical Characteristic | |
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Current Rating | 7A |
Max. Voltage | 500V AC |
Solder Process Characteristic | |
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Solder Process Type | Wave soldering |
Max. Process Temperature | 265℃ |
Duration at Max. Process Temperature | 3~5s |
Environment Characteristic | |
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RoHS / Halogen Free (HF) Compliance | HF |
Others | |
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Packaging | Tray |