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Always Connecting. Reliable Partner
3.0mm Pitch 2x4 Pin Vertical DIP Wafer

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P/N : ABA-WAF-527

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Product General Characteristic
Product Overview3.0mm Pitch 2x4 Pin Vertical DIP Wafer
Component TypeReceptacle
PCB Mount TypeTH
OrientationVertical
Physical Characteristic
Housing MaterialLCP
Contact MaterialC1100
Plating Material on Contact AreaTin
Plating Thickness on Contact Area80u"
Circuits8 Pin
Pitch3.0mm
Tail Length4.9mm
Locating Post1.0mm
Durability25 Cycles
Housing ColorBlack
Electrical Characteristic
Current Rating7A
Max. Voltage500V AC
Solder Process Characteristic
Solder Process TypeWave soldering
Max. Process Temperature265℃
Duration at Max. Process Temperature3~5s
Environment Characteristic
RoHS / Halogen Free (HF) ComplianceHF
Others
PackagingTray
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