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3.0mm Pitch 1x10 Pin R/A DIP Wafer

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P/N : ABA-WAF-739

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Product General Characteristic
Product Overview3.0mm Pitch 1x10 Pin R/A DIP Wafer
Component TypeReceptacle
PCB Mount TypeTH
OrientationRight Angle
Physical Characteristic
Housing MaterialLCP
Contact MaterialC1100
Plating Material on Contact AreaGold
Plating Thickness on Contact Area1u"
Circuits10 Pin
Pitch3.0mm
Tail Length3.82mm
Durability25 Cycles
Housing ColorBlack
Electrical Characteristic
Current Rating6A
Max. Voltage500V AC
Solder Process Characteristic
Solder Process TypeWave soldering
Max. Process Temperature265℃
Duration at Max. Process Temperature3~5s
Environment Characteristic
RoHS / Halogen Free (HF) ComplianceHF
Others
PackagingTray
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