Always Connecting
3.0mm Pitch 1x10 Pin R/A DIP Wafer
Fan Header
P/N : ABA-WAF-739
| Product General Characteristic | |
|---|---|
| Product Overview | 3.0mm Pitch 1x10 Pin R/A DIP Wafer |
| Component Type | Receptacle |
| PCB Mount Type | TH |
| Orientation | Right Angle |
| Physical Characteristic | |
|---|---|
| Housing Material | LCP |
| Contact Material | C1100 |
| Plating Material on Contact Area | Gold |
| Plating Thickness on Contact Area | 1u" |
| Circuits | 10 Pin |
| Pitch | 3.0mm |
| Tail Length | 3.82mm |
| Durability | 25 Cycles |
| Housing Color | Black |
| Electrical Characteristic | |
|---|---|
| Current Rating | 6A |
| Max. Voltage | 500V AC |
| Solder Process Characteristic | |
|---|---|
| Solder Process Type | Wave soldering |
| Max. Process Temperature | 265℃ |
| Duration at Max. Process Temperature | 3~5s |
| Environment Characteristic | |
|---|---|
| RoHS / Halogen Free (HF) Compliance | HF |
| Others | |
|---|---|
| Packaging | Tray |