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3.0mm Pitch 2x2 Pin Vertical DIP Wafer

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P/N : ABA-WAF-442

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Product General Characteristic
Product Overview3.0mm Pitch 2x2 Pin Vertical DIP Wafer
Component TypeReceptacle
PCB Mount TypeTH
OrientationVertical
Physical Characteristic
Housing MaterialPA66
Contact MaterialC2700
Plating Material on Contact AreaTin
Plating Thickness on Contact Area100u"
Circuits4 Pin
Pitch3.0mm
Tail Length2.69mm
Locating Post0.85mm
Durability25 Cycles
Housing ColorBlack
Electrical Characteristic
Current Rating5A
Max. Voltage500V AC
Solder Process Characteristic
Solder Process TypeWave soldering
Max. Process Temperature265℃
Duration at Max. Process Temperature3~5s
Environment Characteristic
RoHS / Halogen Free (HF) ComplianceRoHS
Others
PackagingBox
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