P/N : ABA-WAF-871
Product General Characteristic | |
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Product Overview | 2.0mm Pitch 2x10 Pin Vertical DIP Wafer |
Component Type | Receptacle |
PCB Mount Type | TH |
Orientation | Vertical |
Physical Characteristic | |
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Housing Material | LCP |
Contact Material | C2700 |
Plating Material on Contact Area | Gold |
Plating Thickness on Contact Area | 30u" |
Circuits | 20 Pin |
Pitch | 2.0mm |
Tail Length | 2.50mm |
Locating Post | 0.85mm |
Durability | 25 Cycles |
Housing Color | Black |
Electrical Characteristic | |
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Current Rating | 1.5A |
Max. Voltage | 500V AC |
Solder Process Characteristic | |
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Solder Process Type | Wave soldering |
Max. Process Temperature | 265℃ |
Duration at Max. Process Temperature | 3~5s |
Environment Characteristic | |
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RoHS / Halogen Free (HF) Compliance | HF |
Others | |
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Packaging | Reel |