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2.0mm Pitch 2x3 Pin Vertical DIP Wafer

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P/N : ABA-WAF-070

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Product General Characteristic
Product Overview2.0mm Pitch 2x3 Pin Vertical DIP Wafer
Component TypeReceptacle
PCB Mount TypeTH
OrientationVertical
Physical Characteristic
Housing MaterialPA46
Contact MaterialC2700
Plating Material on Contact AreaTin
Plating Thickness on Contact Area100u"
Circuits6 Pin
Pitch2.0mm
Tail Length3.00mm
Locating Post1.30mm
Durability25 Cycles
Housing ColorBlack
Electrical Characteristic
Current Rating1.0A
Max. Voltage500V AC
Solder Process Characteristic
Solder Process TypeWave soldering
Max. Process Temperature265℃
Duration at Max. Process Temperature3~5s
Environment Characteristic
RoHS / Halogen Free (HF) ComplianceHF
Others
PackagingTray
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