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2.0mm Pitch 2x4 Pin Vertical DIP Wafer

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P/N : AWAFA104

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Product General Characteristic
Product Overview2.0mm Pitch 2x4 Pin Vertical DIP Wafer
Component TypeReceptacle
PCB Mount TypeTH
OrientationVertical
Physical Characteristic
Housing MaterialPA10T
Contact MaterialC19400
Plating Material on Contact AreaGold
Plating Thickness on Contact Area15u"
Circuits8 Pin
Pitch2.0mm
Durability25 Cycles
Housing ColorBlack
Electrical Characteristic
Current Rating4.5A
Max. Voltage500V AC
Solder Process Characteristic
Solder Process TypeWave soldering
Max. Process Temperature265℃
Duration at Max. Process Temperature3~5s
Environment Characteristic
RoHS / Halogen Free (HF) ComplianceHF
Others
PackagingReel
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