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2.0mm Pitch 2x4 Pin Vertical DIP Wafer

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P/N : ABA-WAF-071

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Product General Characteristic
Product Overview2.0mm Pitch 2x4 Pin Vertical DIP Wafer
Component TypeReceptacle
PCB Mount TypeTH
OrientationVertical
Physical Characteristic
Housing MaterialPA46 / LCP
Contact MaterialC2700
Plating Material on Contact AreaTin
Plating Thickness on Contact Area100u"
Circuits8 Pin
Pitch2.0mm
Tail Length2.50mm
Locating Post1.30mm
Durability25 Cycles
Housing ColorBlack/BLUE
Electrical Characteristic
Current Rating3.0A
Max. Voltage500V AC
Solder Process Characteristic
Solder Process TypeWave soldering
Max. Process Temperature265℃
Duration at Max. Process Temperature3~5s
Environment Characteristic
RoHS / Halogen Free (HF) ComplianceHF
Others
PackagingTray
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