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2.0mm Pitch Vertical DIP Wafer (6/8/9 Pin)

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P/N : ABA-WAF-234

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Product General Characteristic
Product Overview2.0mm Pitch Vertical DIP Wafer (6/8/9 Pin)
Component TypeReceptacle
PCB Mount TypeTH
OrientationVertical
Physical Characteristic
Housing MaterialPA46 / LCP
Contact MaterialC2700 / C1100
Plating Material on Contact AreaGold
Plating Thickness on Contact Area1u" / 15u"
Circuits6 / 8 / 9 Pin
Pitch2.0mm
Tail Length2.30mm
Locating Post1.20mm
Durability25 Cycles
Housing ColorBlack
Electrical Characteristic
Current Rating3.0A
Max. Voltage500V AC
Solder Process Characteristic
Solder Process TypeWave soldering
Max. Process Temperature265℃
Duration at Max. Process Temperature3~5s
Environment Characteristic
RoHS / Halogen Free (HF) ComplianceHF
Others
PackagingReel
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