P/N : ABA-WAF-571-P01
Product General Characteristic | |
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Product Overview | 1.0mm Pitch 1x4 Pin SMT Wafer |
Component Type | Receptacle |
Orientation | Right Angle |
Physical Characteristic | |
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Housing Material | LCP |
Contact Material | C2680 |
Plating Material on Contact Area | Gold |
Plating Thickness on Contact Area | 1u" |
Circuits | 4 Pin |
Pitch | 1.0mm |
Durability | 25 Cycles |
Housing Color | Black |
Electrical Characteristic | |
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Current Rating | 2.0A |
Max. Voltage | 500V AC |
Solder Process Characteristic | |
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Solder Process Type | Reflow soldering |
Max. Process Temperature | 265℃ |
Duration at Max. Process Temperature | 10s |
Environment Characteristic | |
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RoHS / Halogen Free (HF) Compliance | HF |
Others | |
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Packaging | Reel |