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1.0mm Pitch 1x6 Pin SMT Wafer

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P/N : ABA-WAF-571-P02

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Product General Characteristic
Product Overview1.0mm Pitch 1x6 Pin SMT Wafer
Component TypeReceptacle
OrientationRight Angle
Physical Characteristic
Housing MaterialLCP
Contact MaterialC2680
Plating Material on Contact AreaGold
Plating Thickness on Contact Area1u" / 15u"
Circuits6 Pin
Pitch1.0mm
Durability25 Cycles
Housing ColorBlack
Electrical Characteristic
Current Rating2.0A
Max. Voltage500V AC
Solder Process Characteristic
Solder Process TypeReflow soldering
Max. Process Temperature265℃
Duration at Max. Process Temperature10s
Environment Characteristic
RoHS / Halogen Free (HF) ComplianceHF
Others
PackagingReel
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