P/N : AWAF0016-P001A02C

| Product General Characteristic | |
|---|---|
| Product Overview | 1.25mm Pitch 2x8 Pin DIP Wafer |
| Component Type | Receptacle |
| PCB Mount Type | TH |
| Orientation | Vertical |
| Physical Characteristic | |
|---|---|
| Housing Material | LCP |
| Contact Material | C2680 |
| Plating Material on Contact Area | Gold |
| Plating Thickness on Contact Area | 15u" |
| Circuits | 16 Pin |
| Pitch | 1.25mm |
| Tail Length | 2.75mm |
| Locating Post | 1.30mm |
| Durability | 25 Cycles |
| Housing Color | Black |
| Electrical Characteristic | |
|---|---|
| Current Rating | 3.0A |
| Max. Voltage | 500V AC |
| Solder Process Characteristic | |
|---|---|
| Solder Process Type | Reflow soldering |
| Max. Process Temperature | 265℃ |
| Duration at Max. Process Temperature | 10s |
| Environment Characteristic | |
|---|---|
| RoHS / Halogen Free (HF) Compliance | HF |
| Others | |
|---|---|
| Packaging | Reel |