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1.25mm Pitch 2x8 Pin SMT+DIP Wafer

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P/N : AWAF0016-P004A02C

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Product General Characteristic
Product Overview1.25mm Pitch 2x8 Pin SMT+DIP Wafer
Component TypeReceptacle
PCB Mount TypeTH
OrientationVertical
Physical Characteristic
Housing MaterialLCP
Contact MaterialC2680
Plating Material on Contact AreaGold
Plating Thickness on Contact Area30u"
Circuits16 Pin
Pitch1.25mm
Durability25 Cycles
Housing ColorBlack
Electrical Characteristic
Current Rating3.0A
Max. Voltage500V AC
Solder Process Characteristic
Solder Process TypeReflow soldering
Max. Process Temperature265℃
Duration at Max. Process Temperature10s
Environment Characteristic
RoHS / Halogen Free (HF) ComplianceHF
Others
PackagingReel
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