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1.0mm Pitch 2x20 Pin SMT Wafer

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P/N : ABA-WAF-760

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Product General Characteristic
Product Overview1.0mm Pitch 2x20 Pin SMT Wafer
Component TypeReceptacle
OrientationVertical
Physical Characteristic
Housing MaterialPA9T
Contact MaterialC2680
Plating Material on Contact AreaGold
Plating Thickness on Contact Area4u"
Circuits40 Pin
Pitch1.0mm
Durability25 Cycles
Housing ColorNatural
Electrical Characteristic
Current Rating1.0A
Max. Voltage500V AC
Solder Process Characteristic
Solder Process TypeReflow soldering
Max. Process Temperature265℃
Duration at Max. Process Temperature10s
Environment Characteristic
RoHS / Halogen Free (HF) ComplianceHF
Others
PackagingReel
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