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2.54mm Pitch 1x3 Pin Vertical DIP Wafer

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P/N : AWAF0032-P001A03C

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Product General Characteristic
Product Overview2.54mm Pitch 1x3 Pin Vertical DIP Wafer
Component TypeReceptacle
PCB Mount TypeTH
OrientationVertical
Physical Characteristic
Housing MaterialPA9T
Contact MaterialC2680
Plating Material on Contact AreaMatte Tin
Plating Thickness on Contact Area100u"
Circuits3 Pin
Pitch2.54mm
Tail Length3.30mm
Durability30 Cycles
Housing ColorBlack
Electrical Characteristic
Current Rating1.5A
Max. Voltage500V AC
Solder Process Characteristic
Solder Process TypeWave soldering
Max. Process Temperature265℃
Duration at Max. Process Temperature3~5s
Environment Characteristic
RoHS / Halogen Free (HF) ComplianceHF
Others
PackagingTape & Reel
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