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2.0mm Pitch 2x8 Pin Vertical DIP Wafer

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P/N : AWAF0057-P001A

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Product General Characteristic
Product Overview2.0mm Pitch 2x8 Pin Vertical DIP Wafer
Component TypeReceptacle
PCB Mount TypeTH
OrientationVertical
Physical Characteristic
Housing MaterialPA9T / LCP
Contact MaterialC2680
Plating Material on Contact AreaGold
Plating Thickness on Contact Area30u"
Circuits16 Pin
Pitch2.0mm
Tail Length2.10mm
Locating Post1.30mm
Durability30 Cycles
Housing ColorBlack
Electrical Characteristic
Current Rating2A
Max. Voltage500V AC
Solder Process Characteristic
Solder Process TypeWave soldering
Max. Process Temperature265℃
Duration at Max. Process Temperature3~5s
Environment Characteristic
RoHS / Halogen Free (HF) ComplianceHF
Others
PackagingTape & Reel
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