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2.54mm Pitch 1x2 Pin Vertical DIP Wafer

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P/N : AWAF0027-P007A03C

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Product General Characteristic
Product Overview2.54mm Pitch 1x2 Pin Vertical DIP Wafer
Component TypeReceptacle
PCB Mount TypeTH
OrientationVertical
Physical Characteristic
Housing MaterialPA9T
Contact MaterialC2700 / C1100
Plating Material on Contact AreaGold
Plating Thickness on Contact Area1u"
Circuits2 Pin
Pitch2.54mm
Tail Length3.0mm
Durability30 Cycles
Housing ColorBlack
Electrical Characteristic
Current Rating3A
Max. Voltage500V AC
Solder Process Characteristic
Solder Process TypeWave soldering
Max. Process Temperature265℃
Duration at Max. Process Temperature3~5s
Environment Characteristic
RoHS / Halogen Free (HF) ComplianceHF
Others
PackagingTape & Reel
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