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Double Compression Interposer

Board to Board Solution

P/N : ACAM0003/4-P001CC

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LOTES Ultra Low Profile Double Compression Interposer is specially designed for ultra-thin space requirements, provides stable connection for Board-to-Board and Flex-to-Board solution. Current configurations available in 56 and 104pin with 0.8mm pitch, customize design is also available for pin counts up to more than 600pin and reduce thickness of 0.2mm. 

The lamination, lithography, etch and laser-based manufacturing processes allow excellent dimension control compared to traditional stamping and molding. The insulation housing structure adopts soft, flexible and reliable polyimide (PI) material, and all-metal spring contacts are firmly embedded onto the coverlay which ensures robustness without loose pieces.


 

Application
・Notebook

・Desktop

・Consumer Devices


 

Feature
・Ultra-thin from 0.2mm to over 1.0mm mated thickness

・Compression-mount (fully separable)

・Quick-turn prototypes

・No molds required

 

P/N PinPitch
(mm)
Length
(mm)
Width
(mm)
Thickness
(mm)
    ACAM0003-P001CC    560.8*0.816.25.90.4
ACAM0004-P001CC1040.8*0.817.87.50.4


Note: Highly customizable to supports various pin configurations up to around 600pins and thickness of 0.2mm.



 



Product General Characteristic
Product OverviewDouble Compression Interposer
Physical Characteristic
Housing MaterialHigh Temperature PI
Contact MaterialCopper Alloy
Plating Material on Contact AreaGold
Circuits56 / 104
Durability200 Cycles
Electrical Characteristic
Current Rating0.5 ~ 1.0A+ per pin
Max. Voltage100V AC
Solder Process Characteristic
Environment Characteristic
RoHS / Halogen Free (HF) ComplianceHF
Others
PackagingTray
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