P/N : ACAM0003/4-P001CC
LOTES Ultra Low Profile Double Compression Interposer is specially designed for ultra-thin space requirements, provides stable connection for Board-to-Board and Flex-to-Board solution. Current configurations available in 56 and 104pin with 0.8mm pitch, customize design is also available for pin counts up to more than 600pin and reduce thickness of 0.2mm.
The lamination, lithography, etch and laser-based manufacturing processes allow excellent dimension control compared to traditional stamping and molding. The insulation housing structure adopts soft, flexible and reliable polyimide (PI) material, and all-metal spring contacts are firmly embedded onto the coverlay which ensures robustness without loose pieces.
・Ultra-thin from 0.2mm to over 1.0mm mated thickness
・Compression-mount (fully separable)
・No molds required
Note: Highly customizable to supports various pin configurations up to around 600pins and thickness of 0.2mm.
|Product General Characteristic|
|Product Overview||Double Compression Interposer|
|Housing Material||High Temperature PI|
|Contact Material||Copper Alloy|
|Plating Material on Contact Area||Gold|
|Circuits||56 / 104|
|Current Rating||0.5 ~ 1.0A+ per pin|
|Max. Voltage||100V AC|
|Solder Process Characteristic|
|RoHS / Halogen Free (HF) Compliance||HF|