Intel

P/N : ACA-ZIF-138

Product General Characteristic
Product Overview	Socket 1150 SMT
Component Type	Receptacle
PCB Mount Type	SMT
Orientation	Vertical

Physical Characteristic
Housing Material	LCP
Contact Material	Copper Alloy
Plating Material on Contact Area	Au
Plating Thickness on Contact Area	15u"
Circuits	1150 pin
Pitch	0.9144mm x 0.9144mm
Durability	30 Cycles
Housing Color	Black

Electrical Characteristic
Current Rating	0.525A
Max. Voltage	360V AC

Solder Process Characteristic
Solder Process Type	IR Reflow
Max. Process Temperature	260℃
Duration at Max. Process Temperature	10s

Environment Characteristic
RoHS / Halogen Free(HF) Compliance	HF

Others
Packaging	Tray