P/N : AZIFS008

| Product General Characteristic | |
|---|---|
| Product Overview | LGA3647 Socket (Right side), 1823Pin, SMT |
| Component Type | Receptacle |
| PCB Mount Type | SMT |
| Orientation | Vertical |
| Physical Characteristic | |
|---|---|
| Housing Material | LCP |
| Contact Material | Copper Alloy |
| Plating Material on Contact Area | Au |
| Plating Thickness on Contact Area | 30u" |
| Circuits | 1823 pin |
| Pitch | 0.8585mm x 0.9906mm |
| Durability | 30 Cycles |
| Housing Color | Black |
| Electrical Characteristic | |
|---|---|
| Current Rating | 1A |
| Max. Voltage | AC 360V |
| Solder Process Characteristic | |
|---|---|
| Solder Process Type | IR Reflow |
| Max. Process Temperature | 260℃ |
| Duration at Max. Process Temperature | 10s |
| Environment Characteristic | |
|---|---|
| RoHS / Halogen Free(HF) Compliance | HF |
| Others | |
|---|---|
| Packaging | Tray |